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Hot Melt Adhesive |
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The hot melt was prepared by a typical prepolymer
procedure. A higher reaction temperature of between 90-100°C
can be used. The final melt is poured into containers and kept under
a nitrogen blanket at room temperature.
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For testing the hot melt adhesive is molten at 90°C
and applied to one side of the substrate. The substrate is then
reheated and the second substrate under minimal pressure. The system
is cured at 90°C for 1 hour.
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The mechanical properties of the adhesive will decrease if polyether
with a higher degree of unsaturation are used. It is possible to
improve the mechanical properties of such polyols by using a small
amount of a tri-functional polyol or with diethanolamine.
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Formulation Hot Melt Adhesive using a low
unsaturation Polyether diol |
Polyether
propylene oxide, ethylene oxide capped, MW 2500 OH # 49 low
unsaturation (CAS # 9003-11-6) |
50 |
35 |
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Propylene glycol MW 400 OH #
280 (CAS # 25322-69-4) |
50 |
50 |
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Polyester MW 2000 |
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15 |
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1,4-butanediol (CAS # 110-63-4) |
1 |
1 |
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4,4-MDI purified NCO %
33 (CAS # 101-68-8) |
43 |
43 |
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Isocyanate index NCO/OH |
1.15 |
1.15 |
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Isocyanate, % |
1.3 |
1.3 |
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Hard segments, % |
30 |
30 |
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Wood to Wood tensile adhesion,
ASTM D897, PSI (kPa) |
85(585) |
90(620) |
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Leather Peel Strength, ASTM D1876, PSI
(kPa) |
20(138) |
15(103) |
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Vinyl Peel Strength, ASTM D1876, PSI
(kPa) |
5(34) |
16(110) |
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Last edited on:
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November 16, 2006
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Copyright®, Design, Layout and Technical Content by:
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